The Stages Semiconductor Manufacturing Production Lines

We can use the simple analogy of building a house to explore the complex process of chip manufacturing:

Front end of production line (FEOL): laying the foundation

The front end of the production line is like laying a foundation and building a wall. In semiconductor manufacturing, this stage involves creating basic structures and transistors on silicon wafers.

Key steps of FEOL:

1. Cleaning: Starting from a thin silicon wafer, clean it to remove any impurities.

2. Oxidation: Growing a layer of silicon dioxide on the wafer to isolate different parts of the chip.

3. Lithography: Lithography technology is used to etch patterns on wafers, which can be imagined as drawing blueprints on the wafer with light.

4. Etching: Etching away unwanted silicon dioxide to expose the desired pattern.

5. Injection: Introducing impurities into silicon to alter its electrical properties. This step creates a transistor, which is the fundamental building block of any chip.

Mid end of production line (MEOL): connecting various points

The middle end of the production line is like installing wires and pipes, and the focus of this stage is to establish connections between the transistors created in FEOL.

The key steps of MEOL are:

1. Dielectric deposition: Deposition of an insulating layer (referred to as a dielectric) to protect the transistor.

2. Contact formation: Form contacts to connect transistors to each other and to the outside world.

3. Interconnection: Add metal layers to create electrical signal paths. Similar to laying wires in a house to ensure seamless flow of electricity and data.

Back end of production line (BEOL): Closing work

The back end of the production line is like finishing the house - installing fixtures, painting, and ensuring everything is in order. In semiconductor manufacturing, this stage involves adding the final layer and preparing the chip for packaging.

Key steps of BEOL:

1. Additional metal layer: Multiple layers of metal are added to enhance interconnectivity, ensuring that the chip can handle complex tasks and high speeds.

2. Passivation: Apply a protective layer to protect the chip from environmental damage.

3. Testing: The chip undergoes rigorous testing to ensure compliance with all specifications.

4. Cutting: The wafer is cut into individual chips, each of which can be packaged and used in electronic devices.

Suzhou Pharma Machinery Co.,Ltd.

2025/07/11

Gino